THINGS2DO
The development of global semiconductor technology is primarily directed towards meeting the needs of products in the area of home electronics that are manufactured at high volume. Important European industries such as automobile and aircraft manufacturing increasingly require more powerful and energy-efficient technologies that also enable structure sizes of 28 nm and smaller. It is therefore essential for high-end applications that European developers are not only offered standard solutions but also modern alternatives.
One promising development in this area is known as FD-SOI technology (fully-depleted silicon on insulator). Among other aspects, it is considered especially robust, low-energy and easy to manufacture. It also permits a high integration density for the semiconductor components. An open German design center will therefore be created in the project “THINGS2DO” for further development of this technology and for larger-scale manufacturing of microchips on this basis.
Solution approach
The virtual design center will consist of various modules and assist German and European companies by making it easier to implement FD-SOI semiconductor components. The goal is to bundle all the necessary competence, tools and design knowledge for successful design projects and offer this to companies and research institutions of all sizes. The platform also offers design competence, access to manufacturing process technology descriptions and EDA tool support bundled into a hosted design environment.
Through easy access for companies, this approach opens up extensive innovation potential and brings together a broad range of expertise in this technology. The virtual design center will make it convenient for semiconductor manufacturers and medium-sized businesses in particular to openly share their own developments. It will also be possible to verify the functionality of new concepts and IP components, and smaller companies will receive access to opportunities for manufacturing in larger part volumes.
THINGS2Do is being funded within the framework of a declaration by the European technology initiative ENIAC and on the basis of the national research program “ICT 2020 – Research for Innovation” of the Federal Ministry of Education and Research (BMBF).