Fraunhofer Institute for Integrated Circuits IISWe have extensive expertise in the field of X-ray image processing, with which we can examine objects, almost irrespective of material and size, for a wide range of inadequacies arising, for example, in production.
Our software solutions are able to detect and evaluate inclusions, defects and porosity automatically during the manufacturing process or manually in the laboratory. However, our tools do more than just detect defects: they can also classify, measure, precisely locate and visualize them. This permits further processing of components with abnormalities, which would previously have been treated as rejects due to a lack of information, as long as those abnormalities are in a non-critical area or if the region is later processed mechanically. Computed tomography (CT) is a particularly suitable tool for this, as it produces an accurate 3D image of the components. Moreover, the metadata obtained feeds directly into the manufacturing process. This intelligent data feedback means production parameters such as pressure or temperature can be set in such a way to prevent critical errors from occurring in the first place.