Together against obsolescence and chip shortages
As part of the Chip Solutions platform, we work with you to tackle the problem of obsolescence and the resulting risks and the issue of chip shortages.
The BCDC is characterized by its comprehensive expertise in the transfer of technologies into application-specific standard products (ASSPs). In addition, it has state-of-the-art laboratory equipment for the characterization and testing of integrated circuits. Another unique selling point of the BCDC is its manufacturer-independent expertise in the semiconductor ecosystem.
Our aim is to minimize the risks of obsolescence by forming alliances with various stakeholders. At BCDC, we also aim to ensure the supply capability of chips through (re)designs in long-life CMOS technologies. We also aim to reduce the costs of testing and series production for customer-specific chip design solutions.
We are particularly targeting companies with long product life cycles that are severely affected by the discontinuation of standard products. We also address distributors who offer special end-of-life services such as long-term storage, product returns and reactivation of components. We also support system integrators who specialize in the development and integration of semiconductor components and systems. Finally, the BCDC offers its services to companies that are severely affected by the discontinuation of semiconductor production lines by semiconductor manufacturers.
Value propositions include consulting services and feasibility analyses to minimize obsolescence risks. We also support you in the pre-development and implementation of IP blocks for ASSP for long-life design systems and offer chip re-design services through efficient and optimized design flows and chip porting. Special error and ESD analyses are also part of BCDC's range of services, as are series test solutions for small batches.
As part of its research and development content, BCDC's Chip Solutions platform focuses on the development of methods to reduce the overall costs of testing and inspection of ICs, the development of design-for-test methodologies, the automation of low-volume tests and the development of design flows for technology porting.