Chip Solutions

Together against obsolescence and chip shortages

As part of the Chip Solutions platform, we work with you to tackle the problem of obsolescence and the resulting risks and the issue of chip shortages.

The BCDC is characterized by its comprehensive expertise in the transfer of technologies into application-specific standard products (ASSPs). In addition, it has state-of-the-art laboratory equipment for the characterization and testing of integrated circuits. Another unique selling point of the BCDC is its manufacturer-independent expertise in the semiconductor ecosystem.

Our aim is to minimize the risks of obsolescence by forming alliances with various stakeholders. At BCDC, we also aim to ensure the supply capability of chips through (re)designs in long-life CMOS technologies. We also aim to reduce the costs of testing and series production for customer-specific chip design solutions.

We are particularly targeting companies with long product life cycles that are severely affected by the discontinuation of standard products. We also address distributors who offer special end-of-life services such as long-term storage, product returns and reactivation of components. We also support system integrators who specialize in the development and integration of semiconductor components and systems. Finally, the BCDC offers its services to companies that are severely affected by the discontinuation of semiconductor production lines by semiconductor manufacturers.

Value propositions include consulting services and feasibility analyses to minimize obsolescence risks. We also support you in the pre-development and implementation of IP blocks for ASSP for long-life design systems and offer chip re-design services through efficient and optimized design flows and chip porting. Special error and ESD analyses are also part of BCDC's range of services, as are series test solutions for small batches.

As part of its research and development content, BCDC's Chip Solutions platform focuses on the development of methods to reduce the overall costs of testing and inspection of ICs, the development of design-for-test methodologies, the automation of low-volume tests and the development of design flows for technology porting.

Existing offers Chip Solutions

Here you will find existing offers from Fraunhofer on the subject of chip solutions. Click on the individual offers for more information and contact.

Analysis and test

HallinOne®: Integrated 3D magnetic field sensor technology

Future offers Chip Solutions - Research areas

Offers are currently being developed for these research areas. Would you like to support us in tailoring the offers to your needs? Then please contact Alina Korbel with your suggestions and for further information. 

And what needs do you have?

»As a manufacturer of medical technology products, I want the semiconductors I use to be available for a long time so that I don't have to redevelop and qualify my electronic components due to discontinuations.«

 

»As a manufacturer of industrial electronics and sensors, I would like to have further options for action in addition to warehousing and PCB redesign in order to realize the most cost-effective obsolescence management possible.«

 

»As a current user of standard ICs, I want a financially viable ASIC despite my low production volumes in order to achieve unique selling points through minimal installation space, power consumption and outstanding technical features.«

 

»As a supplier to the aviation industry, I want to gain greater control over my electronics supply chain to minimize subsequent risks from components illegally entering the supply chain and backdoors in ICs.«

 

»As a semiconductor manufacturer, I want to be able to offer my customers sensible alternatives to my unprofitable products in order to maintain profitability and customer satisfaction at the same time.«

 

Click here for the other business platforms of the Bavarian Chip Design Center

 

IC - Design Ecosystem - Chiplet Systems

Lorem ipsum

 

IC - Design Ecosystem - Digital Signal Processing

 

IC - Design Ecosystem - Secure System-on-Chip

Lorem ipsum

 

IC - Design Ecosystem - Sensor- & Aktorsysteme und KI

Lorem ipsum

Your contact for the Chip Solutions platform

Alina Korbel

Contact Press / Media

Alina Korbel

Business Development

Fraunhofer IIS
Am Wolfsmantel 33
91058 Erlangen, Deutschland

Phone +49 9131 776 4076