Chiplet Systems

The Chiplet Systems platform gives small and medium-sized enterprises (SMEs) and start-ups easy access to solutions with non-monolithic chiplet systems. Chiplet components are reused, reducing development time, costs and risk for the customer.  

It is aimed in particular at companies that have specific requirements, such as installation space, low power, high precision or high speed, for components in small quantities. The offer is also aimed at companies with complex product families that want to use the same basic components, as well as those that want to ensure the interchangeability of components during the product life cycle.

With regard to chiplets, the BCDC is characterized by access to the EU pilot line of the EU Chips Act "Advanced Heterogeneous System Integration" of the Research Fab Microelectronics Germany. It also offers a broad CMOS technology portfolio and access to advanced circuit technologies in combination with other BCDC platforms. It also enables small-volume production and chiplet assembly.

Value propositions include chiplet system design and feasibility studies with selection of chiplet and assembly technologies. The BCDC enables the development of chiplets with specific functionality, manufactured in optimal CMOS technology and offers support in the organization of the supply chain.

Within the framework of the EU Chips Act, research and development content is jointly developed in the following areas: silicon-tested chiplets, RISC-V, communication, integrated sensors and neuromorphic circuits as well as design flows for 2.5 / 3D integration.

Offers are currently being developed for these research areas. Would you like to support us in tailoring the offers to your needs? Then please contact Cécile Mohr with your suggestions and for further information. 

»As a manufacturer of automotive sensors, we want cost-effective and high-performance sensor ICs that are high-voltage-capable and can be connected directly to CAN or LIN in order to minimize the number of additional components in the vehicle and thus the system costs.«

»As an innovative medium-sized company with low production volumes, we want to integrate high computing power into our miniaturized sensors in order to offer our customers valuable AI functions.«

»As a medical technology manufacturer, we want to combine detector materials with readout ICs and fast data transmission in a small installation space in order to make the next generation of radiotherapy devices significantly smaller and more flexible.«